| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XC7A200T-2FB676C | 其他被动元件 |
XILINX/赛灵思 |
BGA |
2025+ |
1200 |
|||
| SI5345A-D-GM | IC |
SILICON/芯科 |
QFN64 |
20+ |
50 |
|||
| STM32L433VCT6 | 32位MCU |
ST/意法 |
QFP100 |
2025+ |
2000 |
|||
| C8051F340-GQR | SILICON/芯科 |
QFP64 |
2024+ |
3000 |
||||
| TLE9351SJ | INFINEON/英飞凌 |
SOP8 |
25+ |
7500 |
||||
| FT4232HL-REEL | FTDI/飞特帝亚 |
QFP |
2024+ |
3000 |
||||
| XC7Z010-2CLG400I | 其他被动元件 |
XILINX/赛灵思 |
BGA |
2020+ |
1100 |
|||
| DSPIC30F3011-30I/PT | IC |
MICROCHIP/微芯 |
QFP44 |
25+ |
500 |
|||
| XC7Z010-2CLG400C | 工控元件 |
XILINX/赛灵思 |
BGA |
2020+ |
1100 |
|||
| AD9363BBCZ | IC |
ADI/亚德诺 |
BGA |
2024+ |
2000 |
|||
| PIC16F914-I/PT | 单片机MCU |
MICROCHIP/微芯 |
QFP44 |
2021+ |
3265 |
|||
| HI3518ERBCV200 | 其他被动元件 |
HISILICON/海思 |
BGA192 |
2020+ |
3000 |
|||
| STM32F091CBU6 | 32位MCU |
ST/意法 |
UPQFN48 |
2020+ |
1349 |
|||
| LAN8810I-AKZE | IC |
MICROCHIP/微芯 |
VQFN-72 |
20+ |
90 |
|||
| MC56F8323VFBE | IC |
NXP/恩智浦 |
QFP64 |
11+ |
56 |
|||
| NVMFS5C456NLT1G | IC |
ONSEMI/安森美 |
DFN |
22+ |
6000 |
|||
| TMS320F28335ZJZA | IC |
TI/德州仪器 |
BGA |
16+ |
180 |
|||
| MT7603UN | IC |
MTK/联发科 |
QFN48 |
24+ |
210 |
|||
| CYUSB3014-BZXI | CYPRESS/赛普拉斯 |
BGA121 |
23+ |
4200 |
||||
| HI3516ARBCV100 | HISILICON/海思 |
BGA |
2020+ |
500 |
商家默认展示20条库存